英国威格斯PEEK耐高温原料
英国威格斯PEEK耐高温原料
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主要经营：工程塑料 ,通用塑料 ，特种塑料 ，弹性体塑料 ，热塑性弹性体 ，合成材料助剂 ，色母料 ，合成橡胶 ，再生塑料 ，泡沫塑料 ，POM , 食品级PC , TPE ，铁氟龙 , 导电ABS , 导电POM , TPR ， TPV ， TPEE ， TPX ， POM ， PVDF ， HDPE ， PPS ， PEI ， PA46 ， PPO ， PPE ， TPU ， CPVC ， ABS ， PBT , PA6 , PA66 , POE , SEBS , SBS , CPE , PEEK , FEP , PTFE , GPPS , HIPS , PVC , EPS , PA12 , PA11 , PMMA , PET , PLA , LCP , PSU , PPSU , PP-B , EVA , PMMA , PET , PPS , POP , 塑料合金 , PBT , PVDF , PSU , PA12 , CPVC , PEI , CAP , PPO , PAI , EFEP , PUR , COC , UHMWPE , PA6T , LCP , PETG , POE ,PA46 , PPA , PA11 , PA9T , EVOH , EMA , PPSU , MBS , ASA , PA1010 , PFA , EEA , PES , PLA , PVDC , SPS , CAB , PPE , PCT , PP-R , 沙林树脂 , MPPO , AES , PA612 , PTT , EAA , PA610 , MDPE , MLLDPE , CMS , TPX , MABS , EBA , LMDPE , ULDPE , PCTG , PAMXD6 , SMMA , PCTA , PC ,PC/ABS , PF , 电木粉 ，
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The main application areas of PEEK, including automotive (including aviation) transportation market accounting for about 50% of PEEK resin consumption, semiconductor manufacturing equipment accounted for 20% , compressor valve piece and other general mechanical parts products accounted for 30% , other markets such as medical devices and analytical instruments account for 10 per cent. 1. In the field of transport machinery such as automobiles, PEEK resins are growing rapidly in the European market, especially in the market for automotive parts and components, especially around the engine parts, transmission parts, steering parts and so on have chosen PEEK plastic to replace some of the traditional high-cost metal as manufacturing materials. As the automotive industry adapts to miniaturization, lightweight and cost reduction requirements, PEEK resin demand will continue to grow. Peek plastic has been used to replace traditional metal parts in 44 parts of a European model. In the IT manufacturing sector, semiconductor manufacturing and electronics are expected to be another growth area for PEEK resin applications. In the semiconductor industry, in order to achieve high functionality and low cost, silicon wafers are required to be larger in size and more advanced in manufacturing technology, low dust, low gas emissions, low ion leaching, low water absorption is the semiconductor manufacturing process of various equipment material requirements, which will be PEEK resin performance.
